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Advanced electronic packaging with emphasis on multichip modules

By: Language: English Publication details: New York The Institute of Electrical and Electronics Engineers 1999 1999Description: xxxii,791 p. IllustrationISBN:
  • 0780347005
Subject(s):
Item type: Reference Books
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Holdings
Item type Current library Collection Call number Status Date due Barcode Item holds
Reference Books Reference Books Engineering Library Lending Section Reference Collection 621.382 ADV (Browse shelf(Opens below)) Available 205048
Total holds: 0

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