Advanced electronic packaging with emphasis on multichip modules
Language: English Publication details: New York The Institute of Electrical and Electronics Engineers 1999 1999Description: xxxii,791 p. IllustrationISBN:- 0780347005
Reference Books
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
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Reference Books
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Engineering Library Lending Section | Reference Collection | 621.382 ADV (Browse shelf(Opens below)) | Available | 205048 |
Total holds: 0
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