Lau, John H <br/><br/>
Microvias  for low cost, high density interconnects 

 - New York  McGraw-Hill  2001 
 - xxiii,565 p.  Illustration 
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRICAL ENGINEERING<br/>ELECTRO MAGNETIC WAVES<br/>ELECTRONICS<br/>MICROWAVES
<br/><br/><label>Universal Decimal Class. No.: </label>621.37  / LAU