Brown, James Ward <br/><br/>
Advanced electronic packaging  with emphasis on multichip modules 

 - New York  The Institute of Electrical and Electronics Engineers  1999 
 - xxxii,791 p.  Illustration 
<br/><br/><label>ISBN: </label>0780347005 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRICAL ENGINEERING<br/>ELECTRONICS<br/>MICROELECTRONICS
<br/><br/><label>Universal Decimal Class. No.: </label>621.382  / ADV