Microvias for low cost, high density interconnects
Language: English Publication details: New York McGraw-Hill 2001 2001Description: xxiii,565 p. IllustrationISBN:- 0071363270

Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
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Engineering Library Lending Section | Lending Collection | 621.37 LAU (Browse shelf(Opens below)) | Available | 208198 | |||
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Engineering Library Lending Section | Reference Collection | 621.37 LAU (Browse shelf(Opens below)) | Available | 208199 |
Total holds: 0
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