Page 108 - New arrivals 2020 ebooks UoR
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eBooks New Arrivals - 2020
Modeling and Design of Electromagnetic
Compatibility for High-Speed Printed
Circuit Boards and Packaging
By: Wei, Xing-Chang.
Edition : 1st ed.
Publisher : Taylor & Francis (2017)
eISBN : 9781315305875
DOI : https://doi.org/10.1201/9781315305875
eBook URL : www.taylorfrancis.com/books/9781315305875
Subject : Engineering & Technology
Page | 93
